parallel processing hardware

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The RTDS Simulator takes advantage of a custom parallel processing hardware architecture assembled in modular units called racks. Each rack contains slot (max. 20) and rail-mounted cards. The racks are installed in one of four sizes of cubicles. The specific composition of an RTDS Simulator depends on the processing and I/O requirements of the intended application. A common communications backplane links all rack mounted cards facilitating information exchange. Each rack's backplane functions independently so that communication of data can be done in parallel thereby reducing communication bottlenecks.
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( i+ }/ \+ T  U6 n+ ~$ }RTDS has a number of different types of cards available including:

    * Giga Processor Card (GPC)
0 ?7 P; [/ z4 G6 g7 o8 P4 x3 N    * Giga-Transceiver I/O Cards
3 ^6 {+ N' N1 h; V: l- X      (GT I/O)
9 W! z$ i# p' P1 i4 h6 x- P    * Giga-Transceiver Network Communication Card (GTNET)
    * Triple Processor Cards (3PC)
    * Inter-Rack Communications Card (IRC)
' l+ {2 u4 F8 N( u) y# b; G  U    * Workstation InterFace Card (WIF)
    * Digital Input and Output Card (DOPTO)
    * High Precision Analogue Input Card (OADC)
9 l4 R9 O# j" P( F- D3 b( H    * Twelve Channel Analogue Output Card (DDAC)
3 J3 I! q0 S5 `    * Digital Input Time Stamping Card (DITS)
    * Digital Patch Panel
$ V7 k& a4 R8 f+ U0 j8 G" ?6 X    * High Voltage Digital Interface Panel

+ k/ z4 |  n2 H% Y! t/ KPlease contact us for more information on these or other hardware items.

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