The RTDS Simulator takes advantage of a custom parallel processing hardware architecture assembled in modular units called racks. Each rack contains slot (max. 20) and rail-mounted cards. The racks are installed in one of four sizes of cubicles. The specific composition of an RTDS Simulator depends on the processing and I/O requirements of the intended application. A common communications backplane links all rack mounted cards facilitating information exchange. Each rack's backplane functions independently so that communication of data can be done in parallel thereby reducing communication bottlenecks.; X; n6 E# M4 R: p4 k8 Q( t
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RTDS has a number of different types of cards available including: ; c8 k* [7 H2 [# }* D; j8 u4 _9 j% n& ~: H' d( Y4 ]9 B
* Giga Processor Card (GPC) - n* w$ r A1 @2 N * Giga-Transceiver I/O Cards 8 L/ k! X8 t2 g6 y" b; b+ X! I (GT I/O), a# k& a/ ^8 c: I7 m& e1 v
* Giga-Transceiver Network Communication Card (GTNET) 7 ]' C- e0 v+ ~ c4 R C * Triple Processor Cards (3PC)6 F% J- _/ B$ x6 W5 x* t' Q+ z
* Inter-Rack Communications Card (IRC) % p. i4 }* g+ ^. u% J! X$ j$ C * Workstation InterFace Card (WIF), S: _; j6 \8 h3 X
* Digital Input and Output Card (DOPTO) & o$ v& ~8 v/ g * High Precision Analogue Input Card (OADC) 4 C) o: T5 ]" [/ r6 H * Twelve Channel Analogue Output Card (DDAC)! k2 P7 G. j: B1 ]( ~# j3 \
* Digital Input Time Stamping Card (DITS): e* z: c) t$ |9 v" ^1 B5 @: n4 \
* Digital Patch Panel 8 |- F7 f: Z( F- ~; p. x * High Voltage Digital Interface Panel7 m$ t6 S- h7 I$ l i& i! H3 x$ q4 v
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Please contact us for more information on these or other hardware items.
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狗仔卡
发表于 2007-6-16 12:12:39
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