parallel processing hardware

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The RTDS Simulator takes advantage of a custom parallel processing hardware architecture assembled in modular units called racks. Each rack contains slot (max. 20) and rail-mounted cards. The racks are installed in one of four sizes of cubicles. The specific composition of an RTDS Simulator depends on the processing and I/O requirements of the intended application. A common communications backplane links all rack mounted cards facilitating information exchange. Each rack's backplane functions independently so that communication of data can be done in parallel thereby reducing communication bottlenecks.

RTDS has a number of different types of cards available including:
* h% B$ h0 u8 ~2 \3 l
4 V& J( [5 X4 l. U" z, P    * Giga Processor Card (GPC)
  I* @3 _- t' L: ?/ x    * Giga-Transceiver I/O Cards
      (GT I/O)
    * Giga-Transceiver Network Communication Card (GTNET)
    * Triple Processor Cards (3PC)
    * Inter-Rack Communications Card (IRC)
) h) t1 n- }4 \    * Workstation InterFace Card (WIF)
    * Digital Input and Output Card (DOPTO)
    * High Precision Analogue Input Card (OADC)
    * Twelve Channel Analogue Output Card (DDAC)
$ G2 Z9 {8 t7 A5 [    * Digital Input Time Stamping Card (DITS)
    * Digital Patch Panel
    * High Voltage Digital Interface Panel

Please contact us for more information on these or other hardware items.

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