parallel processing hardware

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The RTDS Simulator takes advantage of a custom parallel processing hardware architecture assembled in modular units called racks. Each rack contains slot (max. 20) and rail-mounted cards. The racks are installed in one of four sizes of cubicles. The specific composition of an RTDS Simulator depends on the processing and I/O requirements of the intended application. A common communications backplane links all rack mounted cards facilitating information exchange. Each rack's backplane functions independently so that communication of data can be done in parallel thereby reducing communication bottlenecks.
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; u" o+ H# H* m  i' FRTDS has a number of different types of cards available including:

6 Z! |2 u6 ^1 u" |: c7 q    * Giga Processor Card (GPC)
. I3 D' w6 R& Q0 i* j$ r# e  ~1 E" {    * Giga-Transceiver I/O Cards
" l+ r0 j# ]4 b7 h      (GT I/O)
' C0 O) D% c4 w    * Giga-Transceiver Network Communication Card (GTNET)
  p* D4 O( n, B& ?$ U    * Triple Processor Cards (3PC)
9 [' Q3 L, h8 D5 ]0 Q    * Inter-Rack Communications Card (IRC)
6 [0 O$ N( E* B% U/ h& j: I% E    * Workstation InterFace Card (WIF)
! v7 Q; k% w/ z6 Y5 k* _    * Digital Input and Output Card (DOPTO)
% [0 \( T' Y! z1 @9 K5 O! f  S    * High Precision Analogue Input Card (OADC)
    * Twelve Channel Analogue Output Card (DDAC)
" w, |8 V+ z( z0 B    * Digital Input Time Stamping Card (DITS)
  t! R4 j, {" u; E2 o6 _7 D* Z    * Digital Patch Panel
    * High Voltage Digital Interface Panel
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& q. [/ c! [3 M) c6 jPlease contact us for more information on these or other hardware items.

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