parallel processing hardware

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The RTDS Simulator takes advantage of a custom parallel processing hardware architecture assembled in modular units called racks. Each rack contains slot (max. 20) and rail-mounted cards. The racks are installed in one of four sizes of cubicles. The specific composition of an RTDS Simulator depends on the processing and I/O requirements of the intended application. A common communications backplane links all rack mounted cards facilitating information exchange. Each rack's backplane functions independently so that communication of data can be done in parallel thereby reducing communication bottlenecks.
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9 u) A* j+ D8 [7 X& c& i& S: b7 SRTDS has a number of different types of cards available including:

* S& ^; T0 ?, [: {( R    * Giga Processor Card (GPC)
5 R. Q" T$ {# v, ]1 j  `    * Giga-Transceiver I/O Cards
, B0 c3 L. J$ K. r5 h      (GT I/O)
    * Giga-Transceiver Network Communication Card (GTNET)
* U" r. f. n- C# w7 p$ E    * Triple Processor Cards (3PC)
    * Inter-Rack Communications Card (IRC)
5 H; g. x% }# r& k    * Workstation InterFace Card (WIF)
0 v9 u7 y+ U/ p    * Digital Input and Output Card (DOPTO)
    * High Precision Analogue Input Card (OADC)
    * Twelve Channel Analogue Output Card (DDAC)
/ B) h( }' W& Z: F/ M2 f    * Digital Input Time Stamping Card (DITS)
    * Digital Patch Panel
    * High Voltage Digital Interface Panel

Please contact us for more information on these or other hardware items.

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