parallel processing hardware

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The RTDS Simulator takes advantage of a custom parallel processing hardware architecture assembled in modular units called racks. Each rack contains slot (max. 20) and rail-mounted cards. The racks are installed in one of four sizes of cubicles. The specific composition of an RTDS Simulator depends on the processing and I/O requirements of the intended application. A common communications backplane links all rack mounted cards facilitating information exchange. Each rack's backplane functions independently so that communication of data can be done in parallel thereby reducing communication bottlenecks.
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; b) L# k& o  IRTDS has a number of different types of cards available including:

# s* a0 v8 J" O+ X/ z    * Giga Processor Card (GPC)
# x* @( t8 ]& B* Z+ H    * Giga-Transceiver I/O Cards
      (GT I/O)
% B1 r5 k0 ]# i8 Y    * Giga-Transceiver Network Communication Card (GTNET)
) M* d) @% w' K" k    * Triple Processor Cards (3PC)
    * Inter-Rack Communications Card (IRC)
    * Workstation InterFace Card (WIF)
; `) v) m+ L! Q    * Digital Input and Output Card (DOPTO)
; S* I# I# d9 C" `    * High Precision Analogue Input Card (OADC)
# n( w) K1 h: n9 d; m, ~    * Twelve Channel Analogue Output Card (DDAC)
    * Digital Input Time Stamping Card (DITS)
! ]8 H" d5 D+ U6 f  ]1 B    * Digital Patch Panel
& v: Y" A! F! x/ \5 i1 ^" U    * High Voltage Digital Interface Panel

Please contact us for more information on these or other hardware items.

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