parallel processing hardware

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The RTDS Simulator takes advantage of a custom parallel processing hardware architecture assembled in modular units called racks. Each rack contains slot (max. 20) and rail-mounted cards. The racks are installed in one of four sizes of cubicles. The specific composition of an RTDS Simulator depends on the processing and I/O requirements of the intended application. A common communications backplane links all rack mounted cards facilitating information exchange. Each rack's backplane functions independently so that communication of data can be done in parallel thereby reducing communication bottlenecks.
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% D' a: @% J* }RTDS has a number of different types of cards available including:
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    * Giga Processor Card (GPC)
    * Giga-Transceiver I/O Cards
      (GT I/O)
    * Giga-Transceiver Network Communication Card (GTNET)
4 v) i; [- k1 [4 b. q: i" ~& \    * Triple Processor Cards (3PC)
    * Inter-Rack Communications Card (IRC)
    * Workstation InterFace Card (WIF)
. \; S# |; q% G, K2 Y! h5 l0 q$ L  Q    * Digital Input and Output Card (DOPTO)
$ ]$ n7 k- R: |    * High Precision Analogue Input Card (OADC)
    * Twelve Channel Analogue Output Card (DDAC)
9 C8 z+ v8 I! ~0 v4 e8 |6 Q    * Digital Input Time Stamping Card (DITS)
( \( c6 G4 a4 y+ ~: m; ^& p    * Digital Patch Panel
8 e0 b5 ^- n9 B    * High Voltage Digital Interface Panel

9 }6 b* y! u. nPlease contact us for more information on these or other hardware items.

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