parallel processing hardware

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The RTDS Simulator takes advantage of a custom parallel processing hardware architecture assembled in modular units called racks. Each rack contains slot (max. 20) and rail-mounted cards. The racks are installed in one of four sizes of cubicles. The specific composition of an RTDS Simulator depends on the processing and I/O requirements of the intended application. A common communications backplane links all rack mounted cards facilitating information exchange. Each rack's backplane functions independently so that communication of data can be done in parallel thereby reducing communication bottlenecks.
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RTDS has a number of different types of cards available including:

: H$ S1 k9 [$ r    * Giga Processor Card (GPC)
    * Giga-Transceiver I/O Cards
      (GT I/O)
    * Giga-Transceiver Network Communication Card (GTNET)
    * Triple Processor Cards (3PC)
& b: L" {: I& @/ d. |+ J    * Inter-Rack Communications Card (IRC)
5 a# h) `- s1 ?6 j" V- F5 @    * Workstation InterFace Card (WIF)
* v# |7 a6 S3 z/ ]+ |    * Digital Input and Output Card (DOPTO)
: o$ v& W$ {$ R, R    * High Precision Analogue Input Card (OADC)
! h: f3 h$ W. n3 b9 H0 X    * Twelve Channel Analogue Output Card (DDAC)
    * Digital Input Time Stamping Card (DITS)
2 w  N  N- U, z- @  c4 k$ d9 j    * Digital Patch Panel
9 D. ~1 |- t0 V8 K: D6 K    * High Voltage Digital Interface Panel
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Please contact us for more information on these or other hardware items.

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