The RTDS Simulator takes advantage of a custom parallel processing hardware architecture assembled in modular units called racks. Each rack contains slot (max. 20) and rail-mounted cards. The racks are installed in one of four sizes of cubicles. The specific composition of an RTDS Simulator depends on the processing and I/O requirements of the intended application. A common communications backplane links all rack mounted cards facilitating information exchange. Each rack's backplane functions independently so that communication of data can be done in parallel thereby reducing communication bottlenecks.. l T$ f9 o2 c* B
2 K/ R% K- B) b. d) _, B5 f) \RTDS has a number of different types of cards available including: & e3 s; n* K/ e' O0 F; f/ ]% s' D: N% o6 I. E* m O2 `
* Giga Processor Card (GPC) 5 }9 K/ x: ^/ Q4 {/ k * Giga-Transceiver I/O Cards . b3 A/ I/ U0 J0 N. t- U$ @ (GT I/O) 3 q6 g: e/ {; c5 U * Giga-Transceiver Network Communication Card (GTNET) ! G) o, N+ L4 u9 ~5 {: u * Triple Processor Cards (3PC). H2 r# `+ p& q5 g, {! Y* s# I
* Inter-Rack Communications Card (IRC)7 Z/ K7 r% }, g; i( D5 I
* Workstation InterFace Card (WIF); x1 w. V2 _% e/ S
* Digital Input and Output Card (DOPTO)2 P8 K8 s+ m/ Y. s
* High Precision Analogue Input Card (OADC) 0 D1 i4 g0 |( q: o2 C' O * Twelve Channel Analogue Output Card (DDAC) * C5 b, O8 j [( H; D% Y3 U * Digital Input Time Stamping Card (DITS)* D; ?0 d8 @* z. S8 |. G
* Digital Patch Panel 4 I1 r! f8 F( {7 ~5 G Z * High Voltage Digital Interface Panel' S! n' v: G1 g2 T2 k0 T% o
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Please contact us for more information on these or other hardware items.