The RTDS Simulator takes advantage of a custom parallel processing hardware architecture assembled in modular units called racks. Each rack contains slot (max. 20) and rail-mounted cards. The racks are installed in one of four sizes of cubicles. The specific composition of an RTDS Simulator depends on the processing and I/O requirements of the intended application. A common communications backplane links all rack mounted cards facilitating information exchange. Each rack's backplane functions independently so that communication of data can be done in parallel thereby reducing communication bottlenecks.
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RTDS has a number of different types of cards available including:
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    * Giga Processor Card (GPC)
0 M  e+ R0 q  a5 ~3 [    * Giga-Transceiver I/O Cards
      (GT I/O)
# I4 w$ ]# V% O% c6 g9 M6 r    * Giga-Transceiver Network Communication Card (GTNET)
7 y$ c$ W1 I# k, n    * Triple Processor Cards (3PC)
! z- }: d  k8 J: v8 K3 V    * Inter-Rack Communications Card (IRC)
    * Workstation InterFace Card (WIF)
    * Digital Input and Output Card (DOPTO)
! }( T# ^% A2 v2 W# R    * High Precision Analogue Input Card (OADC)
* m  }0 |. i+ n/ f0 C1 |    * Twelve Channel Analogue Output Card (DDAC)
    * Digital Input Time Stamping Card (DITS)
    * Digital Patch Panel
    * High Voltage Digital Interface Panel

Please contact us for more information on these or other hardware items.

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